Tsev > Xov xwm > Ntsiab lus
Multilayer Board Ntawm Cov Khoom Muag Nruj Nrab Mainstream
May 31, 2017

Ntau lub rooj tsavxwm ntau txoj kev los ntawm cov txheej txheem sab nraud ntawm thawj zaug ua, thiab tom qab ntawd luam tawm etching txoj kev ua los ntawm ib zaug los yog ob tog sib npaug substrate, thiab mus rau hauv cov txheej txheem, thiab tom qab ntawd los ntawm cua kub, siab thiab sib raug zoo, raws li rau Drilling yog tib yam li hais tias ntawm ob lub vaj huam sib luag. Cov kev siv ntawm kev lag luam thiab lub sijhawm xyoo 1960 tsis hloov ntau txoj cai, tab sis nrog cov khoom siv thiab cov txheej txheem siv tshuab (xws li: tsevneeg cov cuab yeej sib xyaw ua ke los daws cov drilling thaum lub kua nplaum quav, cov yeeb yaj kiab ntxiv) ntawm lub rooj tsavxwm yog ntau ntau haiv neeg.

Lub rooj tswj hwm multilayer tau qhia tawm los ntawm peb txoj kev ntawm Clearance Qhov, Tsim Txog thiab PTH. Vim tias qhov sib txawv ntawm qhov sib txawv ntawm txoj kev ua haujlwm, thiab lub siab ceev yog tsawg, nws tsis yog cov tswv yim. Vim tias tsis yooj yim ntawm txoj kev tsim, ua ke nrog cov txiaj ntsim ntawm kev siab ceev, tab sis vim yog lub siab ntom nti ntawm qhov kev thov yog tsis ceev li, tau tsis zoo; Seoul nyob ze vim yog qhov kev thov rau qhov kev sib tham ntawm high-density Circuit Board, ib zaug dua los ua cov tuam txhab ua lag luam R & D ua kom pom tseeb. Raws li tib txoj kev nrog ob txoj hauv kev sib npaug PTH, nws tseem yog qhov feem ntau ntawm cov txheej txheem tsim ntau yam.

Nrog lub VLSI, cov khoom siv ntawm Miniaturization, kev cia siab ntawm kev ua tau zoo, muaj ntau txheej txhooj nrog high-direction circuit nrog high-direction rau pem hauv ntej, yog li qhov kev thov rau high-density, kab thaiv siab Yiyin, kuj cuam tshuam nrog cov yam ntxwv ntawm hluav taws xob (xws li Crosstalk, nrog kev sib nrauj ntawm tus yam ntxwv impedance) ntau cov cai uas yuav tsum tau ua. Lub npe ntawm cov ntu ntau qhov thiab qhov chaw sib txuas ntawm lub dav hlau (SMD) ua rau cov qauv ntawm lub rooj sib tham ntawm lub rooj sib tham ua ntau, tus neeg xyuas kab thiab cov pore me me, thiab kev loj hlob ntawm High School Multilayer Board (10 mus rau 15 txheej) Qhov kawg ntawm ib nrab ntawm cov 1980s, kom tau raws li qhov xav tau ntawm cov me, hnyav high-density thaiv, qhov me me sib, 0.4 ~ 0.6 hli tuab nyias nyias Multilayer Board yog maj mam nrov. Punch ua tiav kom tiav qhov chaw ntawm lub qhov thiab cov duab. Tsis tas li ntawd, ib qho tsawg ntawm ntau ntau hom khoom, kev siv photoresist tsim ib tug qauv ntawm photography.

High-power amplifier - substrate: ceramic + FR-4 phaj + tooj liab puag, txheej: 4 txheej + tooj liab qab, kho deg: immersion kub, nta: ceramic + FR-4 phaj sib xyaw laminated, nrog tooj liab zom.

Tub rog high-frequency multi-layer board - substrate: PTFE, thickness: 3.85mm, cov txheej: 4 txheej, nta: dig muag qhov faus, nyiaj muab tshuaj txhuam sau.

Ntsuab khoom: substrate: ib puag ncig tiv thaiv FR-4 phaj, thickness: 0.8 hli, cov khaubncaws sab nraud povtseg: 4 txheej, luaj li cas: 50mm × 203mm, kab dav / kab nrug: 0.8 hli, aperture: 0.3 hli, ntom tshuaj: .

High-frequency, siab Tg taw tes - substrate: BT, cov khaubncaws sab nraud povtseg: 4 txheej, thickness: 1.0mm, kho deg: kub.

Cov dej khov: 4-nyhav / 4mils, cov tawv ntoo tawv daj: xim daj.

DCDC, hwj huam module - substrate: Tg tuab tooj liab ntawv, FR-4 daim ntawv, qhov loj: 58 mm × 60 hli, kab dav / kab nrug: 0.15mm, pore loj: 0.15mm, thickness: 1.6mm,, Kev kho qhov chaw: , nta: txhua txheej ntawm tooj npog tuab ntawm 3OZ (105um), qhov muag dig muag qhov tshuab, siab tso tawm tam sim no.

High-frequency multi-layer board - substrate: ceramic, cov khaubncaws sab nraud povtseg: 6 layers, thickness: 3.5mm, kev kho deg: immersion kub, nta: faus qhov.

Photoelectric conversion module - substrate: ceramic + FR-4, qhov loj: 15 hli × 47mm, kab dav / kab nrug: 0.3mm, cov xaim: 0.25mm, cov khaubncaws sab nraud povtseg: 6 layers, thickness: 1.0mm, qhov chaw kho: Goldfinger, nta: tso chaw nyob.

Backplane - substrate: FR-4, cov khaubncaws sab nraud povtseg: 20 layers, thickness: 6.0mm, txheej tooj liab: 1/1 moog haujlwm (OZ), kev kho deg: immersion kub.

Micro modules - substrate: FR-4, muaj cov khaubncaws sab nraud povtseg: 4 txheej, thickness: 0.6mm, deg kho: immersion kub, kab dav / kab nrug: 4mils / 4mils, nta: qhov muag tsis pom qhov, qhov hluav taws xob ib sab.

Qhov chaw sib txuas lus: FR-4, cov khaubncaws sab nraud povtseg: 8 layers, thickness: 2.0mm, deg kho: spray tin, kab dav / kab nrug: 4mils / 4mils, nta: tsaus ci tiv taus, BGA impedance tswj.

Cov ntaub ntawv tsho: FR-4, cov ntau txheej: 8 layers, thickness: 1.6 hli, kev kho deg: immersion kub, kab dav / kab nrug: 3mils / 3mils, lub cev tiv taus: ntsuab matte, nta: BGA, Impedance control .