Tsev > Xov xwm > Ntsiab lus
Multilayer Board Siv Tus Nqi
Jul 05, 2017

Nyob rau hauv xyoo tsis ntev los no, nrog VLSI, hluav taws xob cheebtsam ntawm lub miniaturization, kev txig siab ntawm kev kawm, Multilayer Board nrog high-direction circuit nrog high-direction,

Yog li, qhov kev thov rau cov kab sib txuas high-speed, lub siab muaj peev xwm ntawm lub hnub, tab sis kuj cuam tshuam nrog cov hluav taws xob yam ntxwv (xws li Crosstalk, nrog kev sib nrauj ntawm cov yam ntxwv impedance) ntau stringent cai. Lub npe ntawm cov ntu ntau qhov chaw thiab qhov chaw ntom ntom rau sab nrauv (SMD) ua rau cov qauv ntawm lub rooj sib txuas ntawm lub rooj dav hlau ntau dua, cov kab xov tooj thiab lub qhov ncauj qhov me me, thiab rau txoj kev loj hlob ntawm Multilayer Board (10 mus rau 15 txheej) Lub tom kawg ntawm ib nrab ntawm cov 1980s, xwv kom ua tau raws li qhov xav tau ntawm me me, hnyav high-density thaiv, qhov me me sib luag, 0.4 ~ 0.6 hli tuab nyias Cov Multilayer Board yog maj mam nrov. Punching ua tiav kom tiav qhov chaw ntawm lub qhov thiab cov duab. Tsis tas li ntawd, ib qho tsawg ntawm ntau ntau hom khoom, kev siv photoresist tsim ib tug qauv ntawm photography. Kev siv lub tshuab ua kom muaj roj ntau hauv cov xim: cov xim muaj hlau nplaum: Fixture: ceramic + FR-4 phaj + tooj liab puag, txheej: 4 txheej + tooj liab qab, kho deg: immersion kub, nta: ceramic + FR-4 phaj sib xyaw laminated, nrog crusher raws crushing. Porous Multilayer Board PCB - Substrate: PTFE, Thickness: 3.85mm, Cov loos txheej: 4 txheej, Nta: Qhov muag dig muag, nyiaj muab tshuaj. Ntsuab: FR-4 daim ntawv, cov thickness: 0.8 hli txheej: 4 txheej, qhov loj: 50mm × 203mm, kab dav / kab nrug: 0.8 hli, aperture: 0.3 hli, kev kho deg: immersion kub, Shen tin. High-frequency, siab Tg taw tes - Substrate: BT,: 4 txheej, thickness: 1.0mm, kho deg: kub. Kev siv lub cev - cov tawv nqaij: FR-4, cov khaubncaws sab nraud povtseg: 8 layers, thickness: 1.6 hli, kev kho deg: tshuaj tsuag hmoov, kab ncaj / kab nrug: 4mils / 4mils, solder resist color: daj. Dcdc, hluav taws xob - substrate: Tg tuab tooj liab ntawv, FR-4 ntawv, qhov loj: 58 mm × 60 hli, kab dav / kab nrug: 0.15mm, Thickness: 1.6mm, cov khaubncaws sab nraud povtseg: 10 txheej, ntu kev kho: immersion kub, nta: txhua txheej ntawm tooj npog tuab ntawm 3OZ (105um), qhov muag dig muag qhov tshuab, siab tso tawm zis. Highly Multilayer Board - substrate: Txheej: 6 txheej, thickness: 3.5mm, qhov kev kho mob npoo: immersion kub, nta: faus qhov. Photoelectric conversion module - substrate: ceramic + FR-4, nti: 15mm47 hli, kab dav / kab nrug: 0.3 hli, 0.25mm, txheej: 6 txheej, thickness: 1.0 hli, kho deg: kub + kub ntiv tes, nta: embedded positioning . Backplane: FR-4, cov khaubncaws sab nraud povtseg: 20 layers, thickness: 6.0 hli, sab nraum txheej: 4 txheej, thickness: 0.6mm, qhov chaw kho: immersion kub, kab dav / kab, cov thickness ntawm txheej: 1 : 1 ounce (OZ), qhov kev kho mob ntawm npoo: immersion kub. Micro-module - substrate: FR-4, Ze li: 4mils / 4mils, nta: qhov muag tsis pom qhov twg, ib qho hluav taws xob ib nrab. Kev sib txuas ntawm lub hauv paus chaw sib ntsib - substrate: FR-4, cov khaubncaws sab nraud povtseg: 8 layers, thickness: 2.0 hli, ntom tshuaj: phom tin, kab dav / 4mils / 4mils, Nta: Tsaus kab laug sab, tswj BGA impedance tswj. Cov ntawv pov thawj: 8-nyhav, Thickness: 1.6 hli, Kev kho qhov chaw ntu: kub ntaiv, kab dav / kab sib txuas: 3mils / 3mils, solder resist xim: ntsuab matte, nta: BGA, impedance tswj .